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The WIT-1 Fully Automatic Intelligent Sample Preparation System is specifically developed for cross-sectional slice detection in industries such as semiconductors and PCB. It is designed for precise positioning detection and analysis of PCB holes, copper, solder joints, and tin balls.
Utilizing a high-definition CCD camera to determine the grinding position, the system automatically completes rough grinding, fine grinding, fine polishing, and cleaning processes.
| Technical Parameters | Specifications | |
|---|---|---|
| Input Requirements | Electricity | 220VAC, 20A |
| Compressed Air | Pressure > 0.6MPa | |
| Water Connection | Water pressure < 0.3MPa | |
| Alignment Station | Camera Pixel | 25 Million |
| Mobile Grinding Head | Rotation | 360-degree rotation |
| Grinding Station | Rotational Speed | 100-1000rpm |
| Storage | Grinding Discs | 10 layers with life reminder |




