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The WIT-1 fully automatic intelligent sample preparation system is specifically developed for cross-sectional slice detection in industries such as semiconductors and PCB. It can be used for precise positioning detection and analysis of PCB holes, copper, solder joints, and tin balls. It uses a high-definition CCD camera to determine the grinding position, enabling it to automatically complete processes such as rough grinding, fine grinding, fine polishing, and cleaning.
| Parameter | Specification | |
|---|---|---|
| Input | Electricity | 220VAC, 20A |
| Compressed air | Pressure > 0.6MPa | |
| External water | Water pressure < 0.3MPa | |
| Sample Box | Square shape | 22x15x12, 30x27x12, 46x39x12mm |
| Alignment | Sample quantity | 21 |
| Camera pixel | 25 million | |
| Marking | Laser marking / code | |
| Grinding Head | Motor | 0.4KW |
| Rotation | 360-degree | |
| Pressure | 5-100N | |
| Work Disc | Rotational speed | 100-1000rpm |
| Diameter | 250mm | |
| Storage | Grinding Disks | 10 layers with life reminder |